Microstructure and properties of Al^sub 2^O3 dispersion-strengthened copper fabricated by reactive synthesis process

Microstructure and properties of Al^sub 2^O3 dispersion-strengthened copper fabricated by reactive synthesis process

Al^sub 2^O3 dispersion-strengthened copper alloy was prepared by reactive synthesis and spark plasma sintering (SPS) process. Studies show that nano-sized γ-Al^sub 2^O3 particles with 27.4 nm mean size and 50-nm interval are homogeneously distributed in copper matrix. The density of SPS alloy is abo...

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Veröffentlicht in:Rare metals 2014-04, Vol.33 (2), p.191
Hauptverfasser: Zhang, Xue-hui, Lin, Chen-guang, Cui, Shun, Li, Zeng-de
Format: Artikel
Sprache:eng
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Zusammenfassung:Al^sub 2^O3 dispersion-strengthened copper alloy was prepared by reactive synthesis and spark plasma sintering (SPS) process. Studies show that nano-sized γ-Al^sub 2^O3 particles with 27.4 nm mean size and 50-nm interval are homogeneously distributed in copper matrix. The density of SPS alloy is about 99 %, meanwhile, the electrical conductivity of sintered alloy is 72 % IACS and the Rockwell hardness can reach to HRB 91.[PUBLICATION ABSTRACT]
ISSN:1001-0521
1867-7185
DOI:10.1007/s12598-013-0149-3