Laser-Enhanced Electroless Gold Plating on Polyimide Resin Film

Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a...

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Veröffentlicht in:Hyōmen gijutsu 1998/12/01, Vol.49(12), pp.1305-1309
Hauptverfasser: NAGAMINE, Satoshi, KOBAYAKAWA, Koichi, SATO, Yuichi
Format: Artikel
Sprache:eng
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Zusammenfassung:Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a copper protector with higher heat conductivity produced a better gold deposit than using the ceramic plate.
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.49.1305