Laser-Enhanced Electroless Gold Plating on Polyimide Resin Film
Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a...
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Veröffentlicht in: | Hyōmen gijutsu 1998/12/01, Vol.49(12), pp.1305-1309 |
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Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | Laser-enhanced electroless gold plating on polyimide resin plate was conducted in a cyanide-free bath. Electroless gold plating on polyimide resin was possible when a breakage protector such as a ceramic or copper plate was set behind the resin plate. The protector acts as a heat scatterer. Using a copper protector with higher heat conductivity produced a better gold deposit than using the ceramic plate. |
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ISSN: | 0915-1869 1884-3409 |
DOI: | 10.4139/sfj.49.1305 |