Improving Productivity in Particle Plating

A study was conducted on reducing particle plating costs by decreasing the cell voltage at the time of electroplating and increasing productivity by means of high-current-density plating. The following results were obtained; 1) When bath temperature was higher, good electroconductive bath is more concentrated and the distance between both electrodes is near. Particle plating can be achieved with fairly low cell voltage provided. 2) The occurrence of the hydrogen gas at the time of high current density plating is able to be inhibitted by using titanium as a cathode material. And the plating of high current efficiency become possible. 3) The structure and crystal orientation of electroplating layer fairly change by addition of brightener and current density. However, plating layer with high current density is more smooth than low current density. It is possible to reduce the production cost remarkably with the improvement of production efficiency by both high current density and high current efficiency, and the consumption electric power reduces by decreasing of cell voltage.