Application of FE-EPMA Evaluation to Microstructure between Pb-free Solder Alloy and Ni-P Coating Layer

Application of FE-EPMA Evaluation to Microstructure between Pb-free Solder Alloy and Ni-P Coating Layer

For evaluation of the microstructure between Pb-free solder alloy and a Ni-P coating layer, the spatial resolution of a field emission electron probe microanalyzer (FE-EPMA) was measured using interfacial morphologies of GaP/InAlP of light emitting diode (LED). The Ni was alloyed with Sn, producing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Hyōmen gijutsu 2011/05/01, Vol.62(5), pp.273-273
Hauptverfasser: IKEMOTO, Sachi, KITAHARA, Yasuko, ODA, Takehide, NOGUCHI, Toshiaki, MAEDA, Chizuko, YAMASHITA, Masaaki
Format: Artikel
Sprache:eng
Schlagworte:
FE-EPMA
LED
Ni-P Coating
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:For evaluation of the microstructure between Pb-free solder alloy and a Ni-P coating layer, the spatial resolution of a field emission electron probe microanalyzer (FE-EPMA) was measured using interfacial morphologies of GaP/InAlP of light emitting diode (LED). The Ni was alloyed with Sn, producing an approximately 300-nm-thick P-rich layer.
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.62.273