Thermal Behavior of Copper(II) Complexes of Salicylic Acid

An anhydrous monomer, Cu (Hsal), (sal= C6H4OCOO) [5], and a dimer, Cu, (Hsal), [6], have already been obtained by thermal decomposition of Cu (Hsal)24H2O[1] by Inoue, et al. In the present work, formation conditions of [5] and [6] were reexamined in detail. Moreover, thermal decomposition processes of [2], [3] and [4] appearing in the preceding report were also studied by means of derivatography and the products identified by means of IR and reflection spectra, magnetic susceptibility and X-ray diffraction pattern. [5] and [6] were prepared at the heating rate above 2°C min-1 and below 0.8 C-min', respectively. The products [7] and [9], which were obtained with the respective 1/3 mole of salicylic acid liberating from [5] and [6], were the different monomer species from each other in spite of the same formula. The products C 8 and [10], which were obtained by releasing additional 1/3 mole of salicylic acid from 7 and [9], respectively, were of the same monomer. The product [6] obtained by the thermal decomposition of [1] was identified as C 2 reported in the preceding paper. Anhydrous complexes, [11] and [12], obtained by the thermal decomposition of [3] and [4], were concluded to be different.