Development of Liquid Solder Resist Based on Polyimide

Development of Liquid Solder Resist Based on Polyimide

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Veröffentlicht in:Journal of Photopolymer Science and Technology 2009/06/30, Vol.22(4), pp.437-439
Hauptverfasser: Matsumura, Nobuo, Shimada, Akira, Yamanaka, Keiko
Format: Artikel
Sprache:eng
Schlagworte:
coverlay
flexible printed circuit board(FPC)
polyimides
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container_title Journal of Photopolymer Science and Technology
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creator Matsumura, Nobuo
Shimada, Akira
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description
doi_str_mv 10.2494/photopolymer.22.437
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source J-STAGE Free; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; Free Full-Text Journals in Chemistry
subjects coverlay
flexible printed circuit board(FPC)
polyimides
title Development of Liquid Solder Resist Based on Polyimide
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