New Assembling-Disassembling Technology Using Electromagnetically Active Adhesives-Dielectric Behaviour

The work refers to a new assembling - disassembling technology based on designing functionally graded bonds by incorporating in the adhesive matrix electromagnetically active nanofillers. These kid of modified adhesives applied with various concentrations of nanofillers within the joints, can significantly increase the functionality of the structure when they are activated in electromagnetic field, at different frequencies. In the same electromagnetic field, the insertion of nanoparticles within the joint provides an immediate disassembly mechanism. The electromagnetic field can be switched using specific triggers. We have investigated the dielectric behavior of modified adhesives and the matrix we used was HF2030 with different percent of nanoparticles.