Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R & D Sites

Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R & D Sites

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Veröffentlicht in:IEEE transactions on semiconductor manufacturing 2007-08, Vol.20 (3), p.215
Hauptverfasser: Oechsner, R, Pfeffer, M, Frickinger, J, Schellenberger, M, Roeder, G, Pfitzner, L, Ryssel, H, Fritzsche, M, Kaushik, V, Renaud, D, Danel, A, Claeys, C, Bearda, T, Lering, M, Graef, M, Murphy, B, Walther, H, Hury, S
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container_issue 3
container_start_page 215
container_title IEEE transactions on semiconductor manufacturing
container_volume 20
creator Oechsner, R
Pfeffer, M
Frickinger, J
Schellenberger, M
Roeder, G
Pfitzner, L
Ryssel, H
Fritzsche, M
Kaushik, V
Renaud, D
Danel, A
Claeys, C
Bearda, T
Lering, M
Graef, M
Murphy, B
Walther, H
Hury, S
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doi_str_mv 10.1109/TSM.2007.901828
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title Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R & D Sites
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