Threshold voltage stability comparison in AlGaN/GaN FLASH MOS-HFETs utilizing charge trap or floating gate charge storage

Enhancement mode operation of AlGaN/GaN devices with breakdown voltage over 700 V is achieved by threshold shifting in a FLASH metal oxide semiconductor heterojunction field effect transistor. Charge stored during a programming step in either a charge trap or metal floating gate charge storage layer...

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Veröffentlicht in:Physica status solidi. C 2012-03, Vol.9 (3-4), p.864-867
Hauptverfasser: Kirkpatrick, Casey, Lee, Bongmook, Choi, YoungHwan, Huang, Alex, Misra, Veena
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Lee, Bongmook
Choi, YoungHwan
Huang, Alex
Misra, Veena
description Enhancement mode operation of AlGaN/GaN devices with breakdown voltage over 700 V is achieved by threshold shifting in a FLASH metal oxide semiconductor heterojunction field effect transistor. Charge stored during a programming step in either a charge trap or metal floating gate charge storage layer is responsible for this shift. Threshold stability for charge trap and floating gate memories is compared with charge trap devices losing
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subjects ALD
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GaN
MOS-HFET
title Threshold voltage stability comparison in AlGaN/GaN FLASH MOS-HFETs utilizing charge trap or floating gate charge storage
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