3D non-destructive grain orientation mapping of polycrystalline materials using 3D-XRD and TEM

3D non-destructive grain orientation mapping of polycrystalline materials using 3D-XRD and TEM

Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.

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Veröffentlicht in:Microscopy and microanalysis 2012-07, Vol.18 (S2), p.728-729
Hauptverfasser: Huang, X., Poulsen, H.F., Schmidt, S., Liu, H.H., Godfrey, A.
Format: Artikel
Sprache:eng
Schlagworte:
Crack propagation
Instrumentation Symposium
Mapping
Measurement and Visualization of Mechanical Behavior at Micro and Nano-scales-02
Microscopy
Morphology
Science
Thin films
X-rays
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Beschreibung
Zusammenfassung:Extended abstract of a paper presented at Microscopy and Microanalysis 2012 in Phoenix, Arizona, USA, July 29 – August 2, 2012.
ISSN:1431-9276
1435-8115
DOI:10.1017/S1431927612005491