High-[Formula Omitted] Inductors Embedded in the Fan-Out Area of an eWLB

We investigate high-quality (high-[Formula Omitted]) inductors implemented in the redistribution layer (RDL) of the fan-in and fan-out area of an embedded wafer-level ball grid array (eWLB) package. The eWLB is an innovative package technology introduced recently for wireless applications. The techn...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-08, Vol.2 (8), p.1280
Hauptverfasser:	Wojnowski, Maciej, Issakov, Vadim, Knoblinger, Gerhard, Pressel, Klaus, Sommer, Grit, Weigel, Robert
Format:	Artikel
Sprache:	eng
Schlagworte:	Integrated circuits Noise Semiconductors
Online-Zugang:	Volltext
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