Growth Behavior of Meta-Stable Intermetallic Compound and Its Potential Influence on the Reliability of Electronic Components

Growth Behavior of Meta-Stable Intermetallic Compound and Its Potential Influence on the Reliability of Electronic Components

The morphology, texture evolution and growth behavior of the meta-stable NiSn 3 intermetallic compound (IMC) in Sn electrodeposits over Ni were investigated. It was found that at lower storage temperatures (

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Veröffentlicht in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011-08, Vol.1 (8), p.1259-1268
Hauptverfasser: Wan Zhang, Clauss, M., Schwager, F.
Format: Artikel
Sprache:eng
Schlagworte:
Aging
Diffraction
growth kinetics
intermetallic compound
Metallurgy
Morphology
reliability
X-ray diffraction
X-ray diffraction data
X-ray scattering
{\rm NiSn}_{3}
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Beschreibung
Zusammenfassung:The morphology, texture evolution and growth behavior of the meta-stable NiSn 3 intermetallic compound (IMC) in Sn electrodeposits over Ni were investigated. It was found that at lower storage temperatures (
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2011.2149534