Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES
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| Veröffentlicht in: | Journal of electronic materials 2014, Vol.43 (12), p.4457-4463 |
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| creator | WONIL SEO KIM, Kyoung-Ho BANG, Jung-Hwan KIM, Mok-Soon SEHOON YOO |
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| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 2014, Vol.43 (12), p.4457-4463 |
| issn | 0361-5235 1543-186X |
| language | eng |
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| source | Springer Nature - Complete Springer Journals |
| subjects | Applied sciences Cross-disciplinary physics: materials science rheology Electrodeposition, electroplating Electronics Exact sciences and technology Materials Materials science Methods of deposition of films and coatings film growth and epitaxy Physics |
| title | Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES |
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