Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES
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| Veröffentlicht in: | Journal of electronic materials 2014, Vol.43 (12), p.4386-4394 |
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| container_title | Journal of electronic materials |
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| creator | TASOOJI, Amaneh LARA, Leticia KYUOH LEE |
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| format | Article |
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| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 2014, Vol.43 (12), p.4386-4394 |
| issn | 0361-5235 1543-186X |
| language | eng |
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| source | SpringerLink Journals - AutoHoldings |
| subjects | Applied sciences Brazing. Soldering Condensed matter: structure, mechanical and thermal properties Defects and impurities in crystals microstructure Diffusion in solids Electromigration Exact sciences and technology Grain and twin boundaries Joining, thermal cutting: metallurgical aspects Metals. Metallurgy Physics Structure of solids and liquids crystallography Transport properties of condensed matter (nonelectronic) |
| title | Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES |
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