Effect of Grain Boundary Misorientation on Electromigration in Lead-Free Solder Joints : Pb-FREE SOLDERS AND MATERIALS FOR EMERGING INTERCONNECT AND PACKAGING TECHNOLOGIES

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Veröffentlicht in:	Journal of electronic materials 2014, Vol.43 (12), p.4386-4394
Hauptverfasser:	TASOOJI, Amaneh, LARA, Leticia, KYUOH LEE
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Condensed matter: structure, mechanical and thermal properties Defects and impurities in crystals microstructure Diffusion in solids Electromigration Exact sciences and technology Grain and twin boundaries Joining, thermal cutting: metallurgical aspects Metals. Metallurgy Physics Structure of solids and liquids crystallography Transport properties of condensed matter (nonelectronic)
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ISSN:	0361-5235 1543-186X