Impact of Joule heating, roughness, and contaminants on the relative hardness of polycrystalline gold

Asperities play a central role in the mechanical and electrical properties of contacting surfaces. Changes in trends of uniaxial compression of an asperity tip in contact with a polycrystalline substrate as a function of substrate geometry, compressive stress and applied voltage are investigated here by implementation of a coupled continuum and atomistic approach. Surprisingly, an unmodified Au polycrystalline substrate is found to be softer than one containing a void for conditions of high stress and an applied voltage of 0.2 V. This is explained in terms of the temperature distribution and weakening of Au as a function of temperature. The findings in this communication are important to the design of materials for electrical contacts because applied conditions may play a role in reversing relative hardness of the materials for conditions experienced during operation.