Fabrication of well-controlled wavy metal interconnect structures on stress-free elastomeric substrates

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Veröffentlicht in:	Microelectronic engineering 2013, Vol.113, p.55-60
Hauptverfasser:	CHAN WOO PARK, SOON WON JUNG, SANG CHUL LIM, OH, Ji-Young, BOCK SOON NA, SANG SEOK LEE, HYE YONG CHU, JAE BON KOO
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Condensed matter: structure, mechanical and thermal properties Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Microelectronic fabrication (materials and surfaces technology) Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Solid surfaces and solid-solid interfaces Surface structure and topography Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
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ISSN:	0167-9317 1873-5568