Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy : WaferBond'11, International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration

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Veröffentlicht in:	Microsystem technologies : sensors, actuators, systems integration actuators, systems integration, 2013, Vol.19 (5), p.689-695
Hauptverfasser:	NAUMANN, Falk, BRAND, Sebastian, BERNASCH, Michael, TISMER, Sebastian, CZURRATIS, Peter, WÜNSCH, Dirk, PETZOLD, Matthias
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Machine components Mechanical engineering. Machine design Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Micromechanical devices and systems Physics Precision engineering, watch making Seals and gaskets Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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ISSN:	0946-7076 1432-1858