Simple compact diode-laser/microlens packaging

Simple compact diode-laser/microlens packaging

A technique has been demonstrated in which the precisely polished substrate of a microlens is directly attached to the front face of a diode laser and heatsink to form a compact stable package. An experimental package using mass-transported GaP spherical microlenses and InGaAs-AlGaAs ridge-waveguide...

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Veröffentlicht in:IEEE journal of quantum electronics 1997-03, Vol.33 (3), p.457-461
Hauptverfasser: Liau, Z.L., Tsang, D.Z., Walpole, J.N.
Format: Artikel
Sprache:eng
Schlagworte:
Chemical lasers
Diode lasers
Exact sciences and technology
Fundamental areas of phenomenology (including applications)
Laboratories
Laser beam cutting
Laser beams
Lasers
Lenses
Microoptics
Optical arrays
Optics
Packaging
Physics
Semiconductor laser arrays
Semiconductor lasers
laser diodes
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Beschreibung
Zusammenfassung:A technique has been demonstrated in which the precisely polished substrate of a microlens is directly attached to the front face of a diode laser and heatsink to form a compact stable package. An experimental package using mass-transported GaP spherical microlenses and InGaAs-AlGaAs ridge-waveguide lasers (0.98-/spl mu/m wavelength) showed a well-collimated beam with a near diffraction-limited 0.7/spl deg/ divergence. The high-index microlens and the favorable lens configuration showed high tolerance for alignment errors in the optical-path-difference and Strehl-ratio calculations.
ISSN:0018-9197
1558-1713
DOI:10.1109/3.556015