Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology: Reliability of High-Power LED Packaging and Assembly

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Veröffentlicht in:	Microelectronics and reliability 2012, Vol.52 (5), p.818-821
Hauptverfasser:	HORNG, Ray-Hua, LIN, Re-Ching, CHIANG, Yi-Chen, CHUANG, Bing-Han, HU, Hung-Lieh, HSU, Chen-Peng
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuits Optoelectronic devices Physics Scanning probe microscopes, components and techniques Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Testing, measurement, noise and reliability
Online-Zugang:	Volltext
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ISSN:	0026-2714 1872-941X