Chip and package-related degradation of high power white LEDs: Reliability of High-Power LED Packaging and Assembly

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Microelectronics and reliability 2012, Vol.52 (5), p.804-812
Hauptverfasser:	MENEGHINI, Matteo, DAL LAGO, Matteo, TRIVELLIN, Nicola, MURA, Giovanna, VANZI, Massimo, MENEGHESSO, Gaudenzio, ZANONI, Enrico
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Fundamental areas of phenomenology (including applications) Integrated circuits Optical sources and standards Optics Optoelectronic devices Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!