Chip and package-related degradation of high power white LEDs: Reliability of High-Power LED Packaging and Assembly

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Veröffentlicht in:	Microelectronics and reliability 2012, Vol.52 (5), p.804-812
Hauptverfasser:	MENEGHINI, Matteo, DAL LAGO, Matteo, TRIVELLIN, Nicola, MURA, Giovanna, VANZI, Massimo, MENEGHESSO, Gaudenzio, ZANONI, Enrico
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Fundamental areas of phenomenology (including applications) Integrated circuits Optical sources and standards Optics Optoelectronic devices Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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ISSN:	0026-2714 1872-941X