Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging

Seven encapsulants with operating temperature up to 250 °C are surveyed for possible use in high-temperature high-power planar packages. Processability is assessed by studying the flow fronts and the cured properties of the surveyed materials between paralleled plates. Material B failed in the flow...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2012-04, Vol.2 (4), p.539-547
Hauptverfasser:	Yiying Yao, Zheng Chen, Guo-Quan Lu, Boroyevich, D., Ngo, K. D. T.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Curing Design. Technologies. Operation analysis. Testing Dielectric breakdown Dielectrics Electrical engineering. Electrical power engineering Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Encapsulation Exact sciences and technology Glass high-temperature Integrated circuits Packaging planar-structure power electronic packaging Power electronics, power supplies Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Substrates
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