Impact of Fin Doping and Gate Stack on FinFET (110) and (100) Electron and Hole Mobilities

Double-gate FinFET (110) (110) and (100) (100} electron mobility (μ e ) and hole mobility (μ h ) are experimentally investigated for the following: 1) a wide range of boron and phosphorus fin doping concentrations and 2) a wide variety of gate stacks combining HfO 2 , SiO 2 , or SiON insulators with...

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Veröffentlicht in:IEEE electron device letters 2012-03, Vol.33 (3), p.351-353
Hauptverfasser: Akarvardar, K., Young, C. D., Baykan, M. O., Injo Ok, Tat Ngai, Kah-Wee Ang, Rodgers, M. P., Gausepohl, S., Majhi, P., Hobbs, C., Kirsch, P. D., Jammy, R.
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Sprache:eng
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Zusammenfassung:Double-gate FinFET (110) (110) and (100) (100} electron mobility (μ e ) and hole mobility (μ h ) are experimentally investigated for the following: 1) a wide range of boron and phosphorus fin doping concentrations and 2) a wide variety of gate stacks combining HfO 2 , SiO 2 , or SiON insulators with TiN or poly-Si electrodes. It is found out that, irrespective of fin doping and gate stack, (110) (110) μ e is competitive with the (100)(100) μ e , while (110)(110) μ h is ≥ 2× higher than (100) (100) μ h . Inversion μ e and μ h are independent of doping as long as the effective field/doping combination enables the screening of the depletion charge. Mobility degradation with doping is significantly lower in accumulation mode (AM) than in inversion mode (IM) such that, for heavily B-doped fins, AM hole mobility exceeds the IM electron mobility even in (100) FinFETs. In undoped fins, ALD TiN gate stress is observed to improve μ e for both orientations without degrading μ h .
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2011.2182603