Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

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Veröffentlicht in:	Journal of electronic materials 2012, Vol.41 (2), p.362-374
Hauptverfasser:	ARFAEI, B, KIM, N, COTTS, E. J
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Electronics Equations of state, phase equilibria, and phase transitions Exact sciences and technology General studies of phase transitions Joining, thermal cutting: metallurgical aspects Materials Materials science Metals. Metallurgy Nucleation Phase diagrams and microstructures developed by solidification and solid-solid phase transformations Physics Solidification
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ISSN:	0361-5235 1543-186X