On the Use of Silver Nanoparticles for Direct Micropatterning on Polyimide Substrates

This paper proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV en...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on nanotechnology 2012-01, Vol.11 (1), p.139-147
Hauptverfasser:	Ng, J. H.-G, Watson, D. E. G., Sigwarth, J., McCarthy, A., Prior, K. A., Hand, D. P., Weixing Yu, Kay, R. W., Changqing Liu, Desmulliez, M. P. Y.
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesion Applied sciences Cross-disciplinary physics: materials science rheology Design. Technologies. Operation analysis. Testing Direct writing Electrodeposition, electroplating Electroless plating Electronics Exact sciences and technology flexible substrate Heat treatment Integrated circuits interconnections Materials science metallization Methods of deposition of films and coatings film growth and epitaxy Microelectronic fabrication (materials and surfaces technology) Micropatterning Nanoparticles Nanoscale materials and structures: fabrication and characterization Nanotechnology Other topics in nanoscale materials and structures packaging photolithography Physics polyimide Polyimide resins Polyimides Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silver silver nanoparticles Substrates Surface morphology Surface treatment Thermal degradation
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	This paper proposes a direct micropatterning process based on the growth of photoreduced silver nanoparticles onto polyimide substrates. The silver nanoparticles are found to have sufficient catalytic efficiency for subsequent electroless plating. Characterization of the process indicates that UV energy dose and heat treatment have to be traded off against photo and thermal degradation of the polymer substrate. Factors affecting the adhesion of the final electroless metal deposit are also discussed.
ISSN:	1536-125X 1941-0085
DOI:	10.1109/TNANO.2011.2160092