Packaging Approach for Integrating 40/45-nm ELK Devices into Wire Bond and Flip-Chip Packages : Best-of-Session Papers from the 60th Electronic Components and Technology Conference

Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011, Vol.1 (11-12), p.1923-1933
Hauptverfasser:	TAN HUA HONG, BELERAN, John, DRAKE, Koh Y. S, WILSON, Ong P. L, MEHTA, Gaurav, LIBRADO, Gatbonton, ZHANG, X. R, SURASIT, C
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology General (including economical and industrial fields) Integrated circuits Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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