Novel Cu-Cu Bonding Technique: The Insertion Bonding Approach : Best-of-Session Papers from the 60th Electronic Components and Technology Conference

Novel Cu-Cu Bonding Technique: The Insertion Bonding Approach : Best-of-Session Papers from the 60th Electronic Components and Technology Conference

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Veröffentlicht in:IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011, Vol.1 (11-12), p.1885-1894
Hauptverfasser: OKORO, Chukwudi, LIMAYE, Paresh, AGARWAL, Rahul, VANDEVELDE, Bart, BEYNE, Eric, VANDEPITTE, Dirk
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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container_end_page 1894
container_issue 11-12
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container_title IEEE transactions on components, packaging, and manufacturing technology (2011)
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creator OKORO, Chukwudi
LIMAYE, Paresh
AGARWAL, Rahul
VANDEVELDE, Bart
BEYNE, Eric
VANDEPITTE, Dirk
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2156-3985
language eng
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source IEEE Electronic Library (IEL)
subjects Applied sciences
Design. Technologies. Operation analysis. Testing
Electronics
Exact sciences and technology
Integrated circuits
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title Novel Cu-Cu Bonding Technique: The Insertion Bonding Approach : Best-of-Session Papers from the 60th Electronic Components and Technology Conference
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