Novel Cu-Cu Bonding Technique: The Insertion Bonding Approach : Best-of-Session Papers from the 60th Electronic Components and Technology Conference

Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2011, Vol.1 (11-12), p.1885-1894
Hauptverfasser:	OKORO, Chukwudi, LIMAYE, Paresh, AGARWAL, Rahul, VANDEVELDE, Bart, BEYNE, Eric, VANDEPITTE, Dirk
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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