Low-temperature low-pressure die attach with hybrid silver particle paste : LOW TEMPERATURE PROCESSING FOR MICROELECTRONICS AND MICROSYSTEMS PACKAGING

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Veröffentlicht in:	Microelectronics and reliability 2012, Vol.52 (2), p.375-380
Hauptverfasser:	SUGANUMA, K, SAKAMOTO, S, KAGAMI, N, WAKUDA, D, KIM, K.-S, NOGI, M
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cross-disciplinary physics: materials science rheology Electrical engineering. Electrical power engineering Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Materials science Nanoscale materials and structures: fabrication and characterization Other topics in nanoscale materials and structures Physics Porous materials granular materials Power electronics, power supplies Specific materials
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ISSN:	0026-2714 1872-941X