Extending acoustic microscopy for comprehensive failure analysis applications: Failure Analysis in Electronics: An EDFAS Special Issue

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2011, Vol.22 (10), p.1580-1593
Hauptverfasser:	BRAND, Sebastian, CZURRATIS, Peter, HOFFROGGE, Peter, TEMPLE, Dorota, MALTA, Dean, REED, Jason, PETZOLD, Matthias
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Brazing. Soldering Design. Technologies. Operation analysis. Testing Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integrated circuits Joining, thermal cutting: metallurgical aspects Metals. Metallurgy Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Testing, measurement, noise and reliability
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ISSN:	0957-4522 1573-482X