Mechanism of atomic-scale passivation and flattening of semiconductor surfaces by wet-chemical preparations : ATOMICALLY CONTROLLED FABRICATION

Bibliographische Detailangaben

Veröffentlicht in:	Journal of physics. Condensed matter 2011, Vol.23 (39)
Hauptverfasser:	ARIMA, Kenta, ENDO, Katsuyoshi, YAMAUCHI, Kazuto, HIROSE, Kikuji, ONO, Tomoya, SANO, Yasuhisa
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Physics Solid surfaces and solid-solid interfaces Surface structure and topography Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
Online-Zugang:	Volltext
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