Development of MEMS Power Sensor Package: Revised and selected papers from the IMAPS 6th Annual International Conference on Device Packaging, Fountain Hills, Arizona, March 2010

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Veröffentlicht in:	Journal of microelectronics and electronic packaging 2010, Vol.7 (3), p.169-174
Hauptverfasser:	KIM, Bruce C, KASIM, Rahim
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology General equipment and techniques Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuits Micro- and nanoelectromechanical devices (mems/nems) Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Sensors (chemical, optical, electrical, movement, gas, etc.) remote sensing
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ISSN:	1551-4897