Influence of gold pick up on the hardness of copper free air ball: COPPER WIRE BONDING

Bibliographische Detailangaben

Veröffentlicht in:	Microelectronics and reliability 2011, Vol.51 (1), p.30-37
Hauptverfasser:	LEE, J, MAYER, M, ZHOU, Y, MOON, J. T, PERSIC, J
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Instruments, apparatus, components and techniques common to several branches of physics and astronomy Integrated circuits Microelectronic fabrication (materials and surfaces technology) Physics Scanning probe microscopes, components and techniques Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!