Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package : Advances in wafer level packaging

Bibliographische Detailangaben

Veröffentlicht in:	Microelectronics and reliability 2010, Vol.50 (4), p.498-506
Hauptverfasser:	SZE, Theresa, POPOVIC, Darko, JING SHI, LAI, Yi-Shao, MITCHELL, James G, GUENIN, Bruce, TSAI, Tsung-Yueh, KAO, Chin-Li, GIERE, Matthew
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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