High-density solder bump interconnect for MEMS hybrid in tegration

Bibliographische Detailangaben

Veröffentlicht in:	IEEE transactions on advanced packaging 2007, Vol.30 (4), p.622-628
Hauptverfasser:	BASAVANHALLY, Nagesh, LOPEZ, Daniel, LAI, Warren, LOW, Yee, MANSFIELD, William, PAI, Chien-Shing, PAPAZIAN, Rick, PARDO, Flavio, SORSCH, Tom, WATSON, Pat, AKSYUK, Vladimir, RAMSEY, Dave, BOWER, Eric, CIRELLI, Ray, FERRY, E, FRAHM, Robert, GATES, John, KLEMENS, Fred
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Micro- and nanoelectromechanical devices (mems/nems) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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