Anisotropic etching rates of single-crystal silicon for TMAH water solution as a function of crystallographic orientation: Special Issue of the Micromechanics Section of Sensors and Actuators, based on contributions revised from the Technical Digest of the Eleventh IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-98), Heidelberg, Germany, 25-29 January 1998

Anisotropic etching rates of single-crystal silicon for TMAH water solution as a function of crystallographic orientation: Special Issue of the Micromechanics Section of Sensors and Actuators, based on contributions revised from the Technical Digest of the Eleventh IEEE International Workshop on Micro Electro Mechanical Systems (MEMS-98), Heidelberg, Germany, 25-29 January 1998

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Veröffentlicht in:Sensors and actuators. A. Physical. 1999, Vol.73 (1-2), p.131-137
Hauptverfasser: SATO, K, SHIKIDA, M, YAMASHIRO, T, ASAUMI, K, IRIYE, Y, YAMAMOTO, M
Format: Artikel
Sprache:eng
Schlagworte:
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Surface cleaning, etching, patterning
Surface treatments
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ISSN:0924-4247
1873-3069