Lead-free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis for micro-BGA assembly

A design-for-reliability methodology was applied to a micro-BGA assembly with lead-free, 95.5Sn-3.8Ag-0.7Cu solder joints. A rate dependent viscoplastic Anand model was curve fitted from a series of constant strain rate tensile test and creep test results. The material parameters for the viscoplasti...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Pang, J.H.L., Low, P.T.H., Xiong, B.S.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Assembly Creep Design methodology Design. Technologies. Operation analysis. Testing Electronics Environmentally friendly manufacturing techniques Exact sciences and technology Fatigue Integrated circuits Lead Predictive models Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Tensile strain Testing
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A design-for-reliability methodology was applied to a micro-BGA assembly with lead-free, 95.5Sn-3.8Ag-0.7Cu solder joints. A rate dependent viscoplastic Anand model was curve fitted from a series of constant strain rate tensile test and creep test results. The material parameters for the viscoplastic Anand model for 95.5Sn-3.8Ag-0.7Cu solder was implemented in finite element analysis. Low cycle isothermal fatigue test was conducted over three frequencies of 1 Hz, 0.01 Hz and 0.001 Hz; three temperatures of 25/spl deg/C, 75/spl deg/C and 125/spl deg/C; and four total strain range values of 2, 3.5, 5, and 7.5% respectively. A micro-BGA assembly with lead-free, 95.5Sn-3.8Ag-0.7Cu solder joints was subjected to (-55 to 125/spl deg/C) thermal cycling test and the Weibull distribution was obtained. FEA modeling and simulation was employed to predict the fatigue life cycles of the micro-BGA package and compared to the MTTF life cycles.
DOI:	10.1109/ITHERM.2004.1318270