A 2Gb/s point-to-point heterogeneous voltage capable DRAM interface for capacity-scalable memory subsystems

We describe a DRAM interface operating at 2Gb/s/pin. It utilizes simultaneous bidirectional signaling in a daisy-chained, point-to-point configuration to enable scalable memory subsystems, and also provides direct attach capability for logic devices. We present results from a system using both logic...

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Hauptverfasser: Kennedy, J., Ellis, R., Jaussi, J., Mooney, R., Borkar, S., Jung-Hwan Choi, Jae-Kwan Kim, Chan-Kyong Kim, Woo-Seop Kim, Chang-Hyun Kim, Soo-In Cho, Loeffler, S., Hoffmann, J., Hokenmaier, W., Houghton, R., Vogelsang, T.
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:We describe a DRAM interface operating at 2Gb/s/pin. It utilizes simultaneous bidirectional signaling in a daisy-chained, point-to-point configuration to enable scalable memory subsystems, and also provides direct attach capability for logic devices. We present results from a system using both logic and DRAM test-chips.
ISSN:0193-6530
2376-8606
DOI:10.1109/ISSCC.2004.1332670