Low-cost embedded capacitor technology with hydrothermal and sol-gel processes

Fabrication of high-k embedded capacitors on printed wiring board (PWB) is limited due to the inherent low-temperature process required for organic packaging. Current dielectrics for embedded capacitors are mostly organic with insufficient dielectric constant. Integration of high-k thin films on PWB...

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Bibliographische Detailangaben
Hauptverfasser:	Abothu, I.R., Raj, P.M., Balaraman, D., Sacks, M.D., Bhattacharya, S., Tummala, R.R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Barium Capacitors Design. Technologies. Operation analysis. Testing Dielectric constant Dielectric thin films Dielectric, amorphous and glass solid devices Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Heat treatment High K dielectric materials High-K gate dielectrics Integrated circuits Microelectronic fabrication (materials and surfaces technology) Plasma temperature Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Titanium compounds Wiring
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Beschreibung
Zusammenfassung:	Fabrication of high-k embedded capacitors on printed wiring board (PWB) is limited due to the inherent low-temperature process required for organic packaging. Current dielectrics for embedded capacitors are mostly organic with insufficient dielectric constant. Integration of high-k thin films on PWB is hindered by high processing temperature of ceramics. The goal of this work, is to develop low-cost/low-temperature, aqueous/non-aqueous based processes for embedded capacitors. Hydrothermal synthesis was used for synthesis of nanograined barium titanate films. Films synthesized at 95/spl deg/C on titanium foils yielded nanograined films (
DOI:	10.1109/ISAPM.2004.1287993