Device applications using bonded SOI wafers

Bibliographische Detailangaben

Hauptverfasser:	FUJINO, Seiji, HIMI, Hiroaki, FUKADA, Tsuyoshi, YAMAGUCHI, Hitoshi
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Acoustic wave devices, piezoelectric and piezoresistive devices Applied sciences Electronics Exact sciences and technology Micro- and nanoelectromechanical devices (mems/nems) Microelectronic fabrication (materials and surfaces technology) Miscellaneous Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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