Packaging of microwave integrated circuits operating beyond 100 GHz

Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB, from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which support...

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Hauptverfasser:	Daniel, E., Sokolov, V., Sommerfeldt, S., Bublitz, J., Olson, K., Gilbert, B., Samoska, L., Chow, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Circuit properties Design. Technologies. Operation analysis. Testing Electric, optical and optoelectronic circuits Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology HEMTs Indium phosphide Insertion loss Integrated circuit measurements Integrated circuit packaging Integrated circuits Loss measurement Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Microwave devices Microwave integrated circuits MMICs Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Transistors Waveguide transitions
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Zusammenfassung:	Several methods of packaging high speed (75-330 GHz) InP HEMT MMIC devices are discussed. Coplanar wirebonding is presented with measured insertion loss of less than 0.5 dB and return loss better than -17 dB, from DC to 110 GHz. A motherboard/daughterboard packaging scheme is presented which supports minimum loss chains of MMICs using this coplanar wirebonding method.. Split-block waveguide packaging approaches are presented in G-band (140-220 GHz) with two types of MMIC-waveguide transitions: E-plane probe and antipodal finline.
DOI:	10.1109/LECHPD.2002.1146777