Etch process development for FLARE for dual damascene architecture using a N2/O2 plasma

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Hauptverfasser:	THOMPSON, H. W, VANHAELEMEERSCH, S, FORESTER, L, MAEX, K, VAN AMMEL, A, BEYER, G, COENEGRACHTS, B, VERVOORT, I, WAETERLOOS, J, STRUYF, H, PALMANS, R
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Metallization, contacts, interconnects device isolation Microelectronic fabrication (materials and surfaces technology) Microelectronics: LSI, VLSI, ULSI integrated circuit fabrication technology Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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DOI:	10.1109/IITC.1999.787078