Post etch cleaning of dual damascene system integrating copper and SiLK

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Bibliographische Detailangaben
Hauptverfasser:	LOUIS, D, PEYNE, C, ARVET, C, LAJOINIE, E, MALONEY, D, LEE, S
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Metallization, contacts, interconnects device isolation Microelectronic fabrication (materials and surfaces technology) Microelectronics: LSI, VLSI, ULSI integrated circuit fabrication technology Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

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DOI:	10.1109/IITC.1999.787091