Millimeter-wave high-power 0.25-μm gate-length AlGaN/GaN HEMTs on SiC substrates

Reports on the CW power performance at 20 and 30 GHz of 0.25 μm × 100 μm AlGaN/GaN high electron mobility transistors (HEMTs) grown by MOCVD on semi-insulating SiC substrates. The devices exhibited current density of 1300 mA/mm, peak dc extrinsic transconductance of 275 mS/mm, unity current gain cut...

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Veröffentlicht in:IEEE microwave and wireless components letters 2003-03, Vol.13 (3), p.93-95
Hauptverfasser: Schwindt, R.S., Kumar, V., Kuliev, A., Simin, G., Yang, J.W., Khan, M.A., Muir, M.E., Adesida, I.
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Sprache:eng
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Zusammenfassung:Reports on the CW power performance at 20 and 30 GHz of 0.25 μm × 100 μm AlGaN/GaN high electron mobility transistors (HEMTs) grown by MOCVD on semi-insulating SiC substrates. The devices exhibited current density of 1300 mA/mm, peak dc extrinsic transconductance of 275 mS/mm, unity current gain cutoff (f T ) of 65 GHz, and maximum frequency of oscillation (f max ) of 110 GHz. Saturated output power at 20 GHz was 6.4 W/mm with 16% power added efficiency (PAE), and output power at 1-dB compression at 30 GHz was 4.0 W/mm with 20% PAE. This is the highest power reported for 0.25-μm gate-length devices at 20 GHz, and the 30 GHz results represent the highest frequency power data published to date on GaN-based devices.
ISSN:1531-1309
1558-1764
DOI:10.1109/LMWC.2003.810115