On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip.