Transient-Liquid-Phase and Liquid-Film-Assisted Joining ofCeramics
Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffu...
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| Veröffentlicht in: | Journal of the European Ceramic Society 2005-02, Vol.26 (4-5) |
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| container_title | Journal of the European Ceramic Society |
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| creator | Sugar, Joshua D. McKeown, Joseph T. Akashi, Takaya Hong, SungM Nakashima, Kunihiko Glaeser, Andreas M. |
| description | Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point ( |
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| issn | 0955-2219 1873-619X |
| language | eng |
| recordid | cdi_osti_scitechconnect_877675 |
| source | Elsevier ScienceDirect Journals |
| subjects | CERAMICS COPPER MATERIALS SCIENCE NIOBIUM |
| title | Transient-Liquid-Phase and Liquid-Film-Assisted Joining ofCeramics |
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