Transient-Liquid-Phase and Liquid-Film-Assisted Joining ofCeramics

Transient-Liquid-Phase and Liquid-Film-Assisted Joining ofCeramics

Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffu...

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Veröffentlicht in:Journal of the European Ceramic Society 2005-02, Vol.26 (4-5)
Hauptverfasser: Sugar, Joshua D., McKeown, Joseph T., Akashi, Takaya, Hong, SungM, Nakashima, Kunihiko, Glaeser, Andreas M.
Format: Artikel
Sprache:eng
Schlagworte:
CERAMICS
COPPER
MATERIALS SCIENCE
NIOBIUM
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Zusammenfassung:Two joining methods, transient-liquid-phase (TLP) joining and liquid-film-assisted joining (LFAJ), have been used to bond alumina ceramics. Both methods rely on multilayer metallic interlayers designed to form thin liquid films at reduced temperatures. The liquid films either disappear by interdiffusion (TLP) or promote ceramic/metal interface formation and concurrent dewetting of the liquid film (LFAJ). Progress on extending the TLP method to lower temperatures by combining low-melting-point (
ISSN:0955-2219
1873-619X