An all-implanted, self-aligned, GaAs JFET with nonalloyed W/p+-GaAs ohmic gate contact

The authors describe a self-aligned, refractory metal gate contact, enhancement mode, GaAs junction field effect transistor (JFET) where all impurity doping was done by ion implantation. Processing conditions are presented for realizing a high gate turn on voltage ([approximately]1.0 V at 1 mA/mm of...

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Veröffentlicht in:IEEE transactions on electron devices 1994-07, Vol.41 (7), p.1078-1082
Hauptverfasser: ZOLPER, J. C, BACA, A. G, HIETALA, V. M, SHUL, R. J, HOWARD, A. J, RIEGER, D. J, SHERWIN, M. E, LOVEJOY, M. L, HJALMARSON, H. P, DRAPER, B. L, KLEM, J. F
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Sprache:eng
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Zusammenfassung:The authors describe a self-aligned, refractory metal gate contact, enhancement mode, GaAs junction field effect transistor (JFET) where all impurity doping was done by ion implantation. Processing conditions are presented for realizing a high gate turn on voltage ([approximately]1.0 V at 1 mA/mm of gate current) relative to GaAs MESFET's. The high gate turn-on voltage is the result of optimizing the p+-gate implant and anneal to achieve a nonalloyed ohmic contact between the implanted p[sup +]-GaAs and the sputter deposited tungsten gate contact. Initial nominally 1.0 [mu]m [times] 50 [mu]m n-JFET's have a transconductance of 85 mS/mm and f[sub t] of 11.4 GHz.
ISSN:0018-9383
1557-9646
DOI:10.1109/16.293333