Thermal transport across few-layer boron nitride encased by silica
Two dimensional hexagonal boron nitride (h-BN) attracted attention for use in applications. Using equilibrium molecular dynamics, we examine the phonon transport in few-layer h-BN encased by silica (SiO2). We report large interfacial thermal resistances, of about 2.2 × 10−8 m2 K W−1, which are not s...
Gespeichert in:
Veröffentlicht in: | Applied physics letters 2015-07, Vol.107 (3) |
---|---|
Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Two dimensional hexagonal boron nitride (h-BN) attracted attention for use in applications. Using equilibrium molecular dynamics, we examine the phonon transport in few-layer h-BN encased by silica (SiO2). We report large interfacial thermal resistances, of about 2.2 × 10−8 m2 K W−1, which are not sensitive to the number of h-BN layers or the SiO2 crystallinity. The h-BN/SiO2 superlattices exhibit ultra-low thermal conductivities across layers, as low as 0.3 W/m K. They are structurally stable up to 2000 K while retaining the low-thermal conductivity attributes. Our simulations indicate that incorporation of h-BN layers and nanoparticles in silica could establish thermal barriers and heat spreading paths, useful for high performance coatings and electronic device applications. |
---|---|
ISSN: | 0003-6951 1077-3118 |
DOI: | 10.1063/1.4927240 |